Memory storage device with heating element

A method according to 21, wherein said storage cell comprises a magnetic tunnel junction.

(canceled)

A method according to 30, wherein said changeable magnetic region is a reversible magnetic region having a magnetization state which can be reversed by applying thereto a selected magnetic field, said reversible magnetic region comprising a material having a magnetization state that is responsive to a change in temperature thereof.

(canceled)

A method according to 30, wherein said passing said electric current through said heating element is for a predetermined time period, wherein said time period is sufficiently short so as to prevent reversal of a magnetization state of one or more storage cells adjacent to the selected storage cell.

A method for writing to a memory storage device on an integrated circuit comprising at least one memory storage device, said method comprising:

• a) providing a storage cell comprising a changeable magnetic region, said changeable magnetic region comprising a material having a magnetization state that is responsive to a change in temperature thereof;
• and
• b) heating an element proximate to said storage cell for selectively changing the temperature of said changeable magnetic region of said storage cell.

A method of writing to a magnetic memory element of an array of magnetic memory elements, the method of comprising:

• heating the memory element wherein the memory element is heated by passing a current through a conductor;
• and applying at least one magnetic field to the memory element.

An information storage device comprising:

• an array of magnetic memory elements;
• and a plurality of heating elements for said array of magnetic memory elements, said heating elements are included with said magnetic memory elements extending across the array.

(canceled)

An information storage device comprising:

• an array of magnetic memory elements;
• and means for performing thermally-assisted switching of selected memory elements in the array said means comprises heating elements included in the devices extending across the array.