Intertwined finger capacitors
AssigneeQUALCOMM Incorporated
InventorDavid Bang
Life of this patent
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AssigneeQUALCOMM Incorporated
InventorDavid Bang
Estimating the term…
Capacitive structures in integrated circuits are disclosed. The capacitive structures are formed on a substrate. Each capacitive structure includes a first conductive finger and a second conductive finger. The first and second conductive fingers are arranged in parallel with each other and separated from each other by a dielectric material. The first finger is connected to a first interconnect and the second conductive finger is connected to a second interconnect. A first capacitor is formed from a first group of the plurality of capacitive structures having respective interconnects coupled together. A second capacitor is formed from a second group of the plurality of capacitive structures having respective interconnects coupled together. The capacitive structures of the first group are intertwined with the capacitive structures of the second group.
An integrated circuit, comprising:
A capacitive structure comprising:
A method for making capacitors, the method comprising:
Dependencies are inferred from the claim text.