Method for pattern metalization of substrates
OwnerCharles Forbes, Alexander Gelbman +3inventors
InventorsCharles Forbes, Alexander Gelbman, Christopher Turner, Helena Gleskova, Sigurd Richard Wagner
Life of this patent
Estimating the term…
Loading patent…
OwnerCharles Forbes, Alexander Gelbman +3inventors
InventorsCharles Forbes, Alexander Gelbman, Christopher Turner, Helena Gleskova, Sigurd Richard Wagner
Estimating the term…
A method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask is provided. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
1-25. (canceled)
A flexible electrophoretic display assembly for displaying graphical indicia, comprising:
Dependencies are inferred from the claim text.