Field-effect semiconductor device and method of fabrication
AssigneeSanken Electric Co., Ltd.
InventorKen Sato
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AssigneeSanken Electric Co., Ltd.
InventorKen Sato
Estimating the term…
After creating an electron transit layer on a substrate, a baffle is formed on midpart of the surface of the electron transit layer, the surface having a pair of spaced-apart parts left on both sides of the baffle. A semiconducting material different from that of the electron transit layer is deposited on its surface thereby conjointly fabricating an electron supply layer grown continuously on the pair of spaced-apart parts of the electron transit layer surface, and a discontinuous growth layer on the baffle in the midpart of the electron transit layer surface. When no voltage is being impressed to the gate electrode on the discontinuous growth layer, this layer creates a hiatus in the two-dimensional electron gas layer generated along the heterojunction between the electron supply layer and electron transit layer. The hiatus is closed upon voltage application to the gate electrode.
A field-effect semiconductor device comprising:
A method of making a field-effect semiconductor device, which comprises:
Dependencies are inferred from the claim text.