Backlight module and light emitting diode package structure therefor

A backlight module, comprising:

• a light guide device having a light incident surface and a light emitting surface;
• a circuit board;
• a plurality of LED package structures, wherein each of the LED package structures is electrically connected to the circuit board and adapted to provide a light beam incident into the light guide device through the light incident surface, and each of the LED package structures comprises:
• a carrier defining a cave with two opposite first side walls, two opposite second side walls and a bottom surface, each of the first side walls connecting a short side of the bottom surface, each of the second side walls connecting a long side of the bottom surface, wherein an included angle between each of the first side walls and the bottom surface is different from an included angle between each of the second side walls and the bottom surface;
• a plurality of LED chips disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier, wherein the center line is parallel to the long side of the bottom surface;
• and
• a package body formed on the carrier to cover the LED chips.