US 2008/0302513 A1 · Method and Device for Tempering a Substrate

Abstract

The invention concerns a device and a method for tempering a substrate (S), as well as a method for making such a device, which comprises the following elements: a first subelements (10) provided with a support surface (20) to be pressed against the substrate (S) and with a first connecting surface, a second subelement (12) provided with a second connecting surface (28) whereby it is pressed at least partly against the first connecting surface (10). At least one of the two subelements (10, 12) contains a ceramic material. At least one of the two connecting surfaces (22, 28) comprises at least one recess (24, 30) which defines at least one cavity (32) in the device. At least one first connecting opening enables a thermostatic liquid to be circulated and/or supplied towards and/or from the cavity (32).

Claims23

Dependent claims

A device for regulating the temperature of a substrate (S) comprising:

a first partial element (10) which has a bearing area (20) for bearing against the substrate (S) and also a first connecting area (22), and
a second partial element (12), which has a second connecting area (28), via which it bears at least partly against the first connecting area (22) of the first partial element (10),
wherein at least one of the two partial elements (10, 12) comprises ceramic material,
at least one cutout (24, 30) which defines at least one cavity (32) in the device is provided at least in one of the two connecting areas (22, 28), and
at least one first connection opening (48) is provided via which a temperature-regulating fluid inflow and/or outflow to and/or from the at least one cavity (32) is made possible.

2 more elements

Dependencies are inferred from the claim text.

Method and Device for Tempering a Substrate

Life of this patent

Method and Device for Tempering a Substrate

Life of this patent

Abstract

Claims23