US 2008/0301931 A1Published application

Method And Apparatus For Mounting Semiconductor Chips

AssigneeUnaxis International Trading Ltd.

InventorDieter Vischer

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Abstract

A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the pick and place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.

Claims1

Dependent claims

An apparatus for mounting semiconductor chips onto a substrate, the apparatus comprising

a rigidly arranged substrate table with a support surface for supporting a substrate,
a transport device for transporting the substrate along a predetermined transport direction,
a wafer table for presenting a semiconductor chip,
a die ejector for supporting detachment of the semiconductor chip from the wafer table,
a Pick and Place device with a bondhead for picking the semiconductor chip presented above the die ejector and placing the picked semiconductor chip onto the substrate, wherein the die ejector is moveable by a predetermined distance d0 parallel to the transport direction of the substrate by means of a drive and wherein the wafer table is moveable by a predetermined distance DW=P+d0 parallel to the transport direction, whereby P designates a diameter of a largest wafer for the accommodation of which the wafer table is designed.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/193,658Filed 18 Aug 2008
Priority: EP 04103158.42 Jul 2004
Published: 11 Dec 2008
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10P 72/0446
Apparatus for manufacture or treatment: apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Y10T 29/4913
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.
Y10T 29/49133
Assembling to base an electrical component, e.g., capacitor, etc.: with component orienting
Y10T 29/53174
Means to assemble electrical device: means to fasten electrical component to wiring board, base, or substrate

Family

Application11/173,396Division · filed 1 Jul 2005
Application12/193,658Division
US 2006/0000082 A1Published application
US 7,415,759 B2Related patent
US 2008/0301931 A1This patent

From the US filing history. Foreign family members aren’t listed.

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