Methods and apparatus for polishing a notch of a substrate by substrate vibration
AssigneeApplied Materials, Inc.
InventorsZhenhua Zhang, Sen-Hou Ko
Life of this patent
Estimating the term…
Abstract
Apparatus and methods are provided for polishing a notch on an edge of a substrate. An exemplary apparatus may include a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch. Numerous other aspects are provided.
Claims25
An apparatus for polishing a notch in a substrate edge comprising:
- a substrate support adapted to support a substrate;
- a polishing head adapted to contact a notch in an edge of the substrate;
- and
- a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch.
A system for polishing a notch in a substrate edge comprising:
- a substrate support adapted to support a substrate;
- a polishing head adapted to press a polishing tape against a notch in an edge of the substrate;
- a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch and to control polishing by the polishing head.
The system of claim 19 wherein the second oscillatory position is at a second oscillatory angle to a neutral radius of the substrate when the substrate is stationary.
A method for polishing a notch in a substrate edge comprising:
- supporting a substrate, wherein an edge of the substrate includes a notch;
- pressing a polishing head against a surface of the notch;
- and
- oscillating the substrate between first and second oscillatory positions while the polishing head is pressed against the notch.
Dependencies are inferred from the claim text.