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US 2008/0293334 A1Published application
Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement
AssigneeApplied Materials, Inc.
InventorsEashwer Kollata, Shou-Sung Chang, Zhenhua Zhang, Paul D. Butterfield, Sen-Hou Ko, Antoine P. Manens, Gary C. Ettinger, Ricardo Martinez
Life of this patent
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Abstract
Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front guide rollers and two pairs of back clamping rollers. Numerous other aspects are provided.
Claims25
An apparatus for polishing an edge of a substrate, the apparatus comprising:
- a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes at least one front roller adapted to guide a polishing tape and at least one pair of back rollers adapted to maintain an alignment of the polishing tape.
A system for polishing an edge of a substrate, the system comprising:
- a substrate support adapted to rotate a substrate;
- a polishing head adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front rollers and two pairs of back rollers;
- a controller adapted to operate the polishing of the edge of the substrate.
A method for polishing an edge of a substrate comprising:
- rotating a substrate;
- contacting an edge of the substrate with a polishing head, wherein the polishing head includes one pair of front rollers and two pairs of back rollers;
- routing a polishing tape between the first pair of back rollers, around the first and second front rollers, and then between the second pair of back rollers, such that the length of polishing tape between the first and second front rollers contacts and polishes the edge of the substrate.
Dependencies are inferred from the claim text.