Prevention and Control of Intermetallic Alloy Inclusions
AssigneeInternational Business Machines Corporation
InventorsSung Kwon Kang, Da-Yuan Shih, Yoon-Chul Son
Life of this patent
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Abstract
In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions, can be achieved through a reaction preventive or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P
Claims8
1-6. (canceled)
7:
- A process for inhibiting intermetallic inclusions in the fabrication of integrated circuit interconnection structures, comprising providing stacked layers on said integrated circuit comprising as a first layer an electroless Ni (P) coating, and as a second layer, a metal selected from Sn or Cu. and as a third layer, a Sn rich Pb-free solder and subjecting said stacked layers to a fusion temperature excursion to fuse said stacked layers together.
8:
- The process of claim 7 wherein said second layer ranges in thickness from 0.1 to 5.0 microns.
9:
- The process of claim 7 wherein said second layer ranges in thickness from 0.1 to 5.0 microns and said temperature excursion is up through 250° C.
The process of claim 7 wherein said second layer ranges in thickness from 0.1 to 5.0 microns and said third layer is a material from the group Sn-0.7% Cu, Sn3% Bi, Sn3.5%-0.7% Cu, Sn-3.5% Ag-3% Bi, Sn-8% Zn-3% Bi, Sn-3.5% Ag-0.7% Cu-0.5% Sb, and Sn-2.5% Ag-0.5% Cu.
11:
- A product made by the process of claim 8.
12:
- A product made by the process of claim 9.
13:
- A product made by the process of claim 10.
Dependencies are inferred from the claim text.