Semiconductor device and manufacturing method therefor
AssigneeKabushiki Kaisha Toshiba
InventorTomohiro Saito
Life of this patent
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Abstract
A method of manufacturing a semiconductor device comprises forming a gate insulation film on a semiconductor substrate; forming a first gate electrode and a second gate electrode on the gate insulation film; forming a mask material so as to expose an upper surface of the first gate electrode while keeping the second gate electrode covered; etching an upper part of the first gate electrode by using the mask material as a mask; removing the mask material; depositing a metal film on the first gate electrode and the second gate electrode; and siliciding the whole of the first gate electrode and an upper part of the second gate electrode.
Claims4
-3. (canceled)
A method of manufacturing a semiconductor device comprising:
- forming a gate insulation film on a semiconductor substrate;
- forming a first gate electrode and a second gate electrode on the gate insulation film;
- forming a mask material so as to expose an upper surface of the second gate electrode while keeping the first gate electrode covered;
- forming a silicidation restricting layer inside the second gate electrode, the silicidation restricting layer being less easily silicided than a material of the first and the second gate electrodes;
- removing the mask material;
- depositing a metal film on the first gate electrode and the second gate electrode;
- and
- siliciding the whole of the first gate electrode and an upper part above the silicidation restricting layer in the second gate electrode.
6-20. (canceled)
Dependencies are inferred from the claim text.