Process For Manufacturing Micromechanical Devices Containing a Getter Material and Devices So Manufactured

A process for manufacturing a micromechanical device comprising two support parts, one of which (12, 20) comprises silicon and the other of which comprises silicon or a semiconductor, ceramic or oxidic material, functional elements (11) and optional auxiliary elements present on at least one of the support parts, and a getter material deposit (13, 24) present on one silicon support part, the method comprising the steps of:

• providing a first support part (10) on which the functional elements (11) and optional auxiliary elements of the device are built;
• providing a second support part (20);
• the first and second support parts being formed such that, when mating, they form a cavity (14) wherein the functional elements, optional auxiliary elements and getter material deposit are housed;
• approaching the two support parts so as to form the cavity and welding the two support parts by direct bonding;
• wherein the getter material deposit is formed on the silicon support part by a first operation of forming on the silicon support part an intermediate layer (23) of a vitreous, ceramic or oxidic material having thickness of at least 50 nanometers, and a second operation of depositing a getter material layer (24) having thickness not greater than 10 micrometers onto the intermediate layer;
• and wherein the getter material comprises an alloy containing zirconium and at least a second element selected from molybdenum, niobium, tantalum and tungsten, wherein zirconium is present in the alloy in a proportion between 70 and 97% by weight.