Electronic component and manufacturing method therefor

An electronic component comprising:

• a sheet substrate;
• a functional element mounted on the sheet substrate;
• and
• a shield cover having an electromagnetic shield function for the functional element,
• wherein the shield cover is of a quadrilateral lid shape and has four peripheral edge sides, and
• wherein respective side faces of the shield cover include inverse L-shaped notches starting from the four peripheral edge sides, and
• wherein areas separated by the notches from the side faces leaving one each side are bent inside the shield cover, and
• wherein the four peripheral edge sides are fixed to the sheet substrate by soldering.

A manufacturing method of an electronic component comprising:

• coating with solder an electrode pad in each area of a plurality of module areas formed on a sheet substrate by screen printing;
• disposing a functional element corresponding to the electrode pad coated with solder, and fixing the functional element to the sheet substrate by reflow process;
• dipping a shield cover of a quadrilateral lid shape having four peripheral edge sides into cream solder supplied to a transcription table, so as to attach the cream solder to the four peripheral edge sides;
• placing the four peripheral edge sides having the cream solder attached thereto on the sheet substrate in such a manner as to surround the functional element disposed on the basis of each module area;
• thereafter, fixing the shield cover to the sheet substrate by reflow process;
• and
• obtaining discrete electronic components by cutting out on the basis of each module area by dicing the sheet substrate having the shield cover fixed thereto.