Semiconductor laser diode and the manufacturing method thereof

A manufacture method for a semiconductor laser diode comprising steps of:

• (a) preparing a semiconductor substrate of a first conductivity type;
• (b) forming a multilayer semiconductor layer by continuously and epitaxially growing a first conductivity type clad layer of the first conductivity type, an active layer, a second conductivity type clad layer of a second conductivity type, and a contact layer of the second conductivity type sequentially stacked on a first plane of said semiconductor substrate;
• (c) forming a plurality of groove forming masks in parallel on said multilayer semiconductor layer by forming a cover film on the side of the first plane of said semiconductor substrate and selectively etching said cover film, said groove forming mask including a ridge forming etching mask for forming a stripe-shaped ridge and a field etching mask for forming a field on both sides of said ridge forming etching mask at positions spaced by a predetermined distance from said ridge forming etching mask;
• (d) by using said groove forming masks as a mask, etching from a surface of said contact layer to a predetermined depth of said first conductivity type clad layer to form a partitioning groove on both sides of said groove forming mask, and in each partitioning region sandwiched between adjacent ones of said partitioning grooves, to form a separation groove between said ridge forming etching mask and said field etching mask, to thereby form a stripe-shaped ridge under said ridge forming etching mask;
• (e) by forming an insulating layer on the side of said first plane of said semiconductor substrate and selectively etching the insulating film, forming an insulating layer covering an area from each side wall of said contact layer of each of said ridges to an edge of said partitioning groove via said separation groove;
• (f) forming a second electrode in each of said partitioning regions, covering an area above said ridge, above said separation grooves on both sides of said ridge and above said multilayer semiconductor layers outside said separation grooves;
• (g) forming
• a first electrode on a second plane opposite to the first plane of said semiconductor substrate;
• (h) cleaving said semiconductor substrate at a predetermined pitch along a direction perpendicular to a longitudinal direction of said ridge to form a plurality of stripe bodies;
• and
• (i) dividing said stripe body at and along portions of predetermined ones of said partitioning grooves to leave a plurality of said partitioning grooves,
• wherein said step (f) comprises steps of:
• (j) forming a second electrode layer on a whole area of the first plane of said semiconductor substrate;
• (k) by forming a photoresist film on the side of the first plane of said semiconductor substrate and electively etching the photoresist film, forming a photoresist film, in said partitioning region including said ridge, said separation groove on both sides of said ridge and said multilayer semiconductor layers adjacent to said separation grooves, having openings each opening an area from a predetermined position of one of said multilayer semiconductor layers to a predetermined position of the other of said multilayer semiconductor layers;
• (l) forming a second plated layer by a plating process on said second electrode layer exposed in each of said openings;
• (m) collectively polishing said photoresist film and said plated layer on the side of the first plane of said semiconductor substrate to planarize surfaces of said photoresist film and said plated layer, and thereafter removing said photoresist film;
• and
• (n) making said second plated layer having a planarized surface through collective polishing on the side of the first plane of said semiconductor substrate have an arc cross section a region corresponding a portion of said ridge is thickest and the second plated layer becomes gradually thin toward said partitioning grooves over said separation grooves, and
• said second electrode is constituted of said second electrode layer and said second plated layer stacked upon said second electrode layer.

A manufacture method for an opto-semiconductor device comprising steps of:

• preparing a semiconductor laser diode comprising:
• a semiconductor substrate of a first conductivity type;
• a multilayer semiconductor layer constituted of a first conductivity type clad layer of the first conductivity type, an active layer, a second conductivity type clad layer of a second conductivity type, and a contact layer of the second conductivity type sequentially stacked on a first plane of said semiconductor substrate;
• a plurality of partitioning grooves formed in said multilayer semiconductor layer, extending from one end to the other end of said semiconductor substrate, and formed from a surface of said contact layer to a predetermined depth of said second conductivity type clad layer;
• a stripe-shaped ridge formed in each partitioning region sandwiched between adjacent ones of said partitioning grooves, and sandwiched between two separation grooves extending from the one end to the other end of said semiconductor substrate and formed from the surface of said contact layer to the predetermined depth of said second conductivity type clad layer;
• an insulating layer covering an area from each side wall of said contact layer of each of said ridges to an edge of said partitioning groove via said separation groove;
• a resonator formed in a potion of said active region corresponding to said ridge;
• a first electrode formed on a second plane opposite to the first plane of said semiconductor substrate and supplying an electric power to each of said resonators;
• and
• a second electrode formed in each of said partitioning regions, covering an area above said ridge, above said separation grooves on both sides of said ridge and above said multilayer semiconductor layers outside said separation grooves,
• wherein:
• said second electrode is constituted of a lower second electrode layer and a second plated layer formed stacked upon said second electrode layer;
• and
• said second plated layer has an arc cross section that a region corresponding a portion of said ridge is thickest and the second plated layer becomes gradually thin toward said partitioning grooves;
• preparing a supporting base plate on which said semiconductor laser diode is stacked and mounted at a first plane of said supporting base plate, said first plane having wirings including electrode pads corresponding to said second electrodes;
• and
• forming a soft conductive bonding material on said electrode pads of said base plate, thereafter abutting, pushing and bonding each of said second electrodes of said semiconductor laser diode to a corresponding one of said electrode pads, subjecting said bonding material to a hardening process to thereby mount said semiconductor laser diode on said supporting base plate.