Package assembly with heat dissipating structure
AssigneeNational Taiwan University
InventorWei-Hsing TUAN
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Abstract
A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the thermal conductive lower metal layer. The patterned upper metal layer is disposed on and bonded to the electric insulating ceramic layer. The patterned upper metal layer has an opening from which the electric insulating ceramic layer is exposed. The electronic component is disposed in the opening of the patterned upper metal layer, mounted on the electric insulating ceramic layer through a thermally conductive adhesive or solder, and electrically connected to the patterned upper metal layer.
Claims17
A package assembly, comprising:
- a thermal conductive lower metal layer;
- an electric insulating ceramic layer disposed on and bonded to the thermal conductive lower metal layer;
- a patterned upper metal layer disposed on and bonded to the electric insulating ceramic layer, wherein the patterned upper metal layer has an opening from which the electric insulating ceramic layer is exposed;
- and
- an electronic component, which is disposed in the opening of the patterned upper metal layer, mounted on the electric insulating ceramic layer through a thermally conductive adhesive or solder, and electrically connected to the patterned upper metal layer.
Dependencies are inferred from the claim text.