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AssigneeThomson Licensing
InventorsDominique Lo Hine Tong, Philippe Minard, Jean-Luc Le Bras
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The present invention relates to a board receiving at least one connector, said board being constituted by a dielectric substrate comprising, on a first face, a first ground plane and on a second face, at least two transmission lines between which the connector and a footprint are mounted, characterized in that the footprint comprises a first element positioned between the two transmission lines under the connector, said first element forming with the first ground plane, a capacitive element and, at each extremity of the first element, second elements forming with the first element, a self-inductive and capacitive element, said second elements each extending by a second ground plane, the second ground planes being connected to the first ground plane. The invention applies notably to printed circuit boards with integrated test connectors.
Board receiving at least one connector, said board being constituted by a dielectric substrate comprising on a first face a first ground plane and on a second face, at least two transmission lines between which the connector and a footprint are mounted, wherein the footprint comprises a first element positioned between the two transmission lines under the connector, said first element forming with the first ground plane, a capacitive element and, at least at one extremity of the first element, a second element forming with the first element, a self-inductive and capacitive element, said second element extending by a second ground plane, said second ground plane being connected to the first ground plane.
Method for producing a footprint for connector on a printed circuit board comprising the steps consisting in:
Dependencies are inferred from the claim text.