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US 2008/0290959 A1Published application
Millimeter wave integrated circuit interconnection scheme
OwnerMohammed Ershad Ali, Rokhsareh Zarnaghi +1inventors
InventorsMohammed Ershad Ali, Rokhsareh Zarnaghi, Chinh Huy Doan
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Abstract
A millimeter-wave integrated circuit (IC) package is disclosed. The package includes a substrate having a plurality of layers and a vertical interconnection. The vertical interconnection comprises a shielded transition between the plurality of layers and a compensation structure to minimize the parasitic effect of the transition.
Claims8
A millimeter-wave integrated circuit (IC) package comprising:
- a substrate having a plurality of layers;
- and
- an interconnection, having:
- a shielded transition between the plurality of layers;
- and
- a compensation structure to reduce the parasitic effect of the transition.
3 more elements
A system comprising:
- a radio frequency IC (RFIC);
- a millimeter-wave integrated circuit (IC) package mounted to the RFIC, comprising:
- a plurality of substrate layers;
- a plurality of flip-chip pads mounted on a first of the plurality of substrate layers to receive millimeter-wave signals from the RFIC;
- and
- an interconnection coupled to the flip-chip pads, having:
- a shielded transition between the plurality of layers;
- and
- a compensation structure to reduce the parasitic effect of the transition.
6 more elements
Dependencies are inferred from the claim text.