Testboard with ZIF connectors, method of assembling, integrated circuit test system and test method introduced by the same

A test board with ZIF connectors, comprising:

• a test substrate having a first surface, a second surface, a plurality of first through-holes, the plurality of first through-holes being perpendicular to the first surface and the second surface of said test substrate;
• at least a socket being affixed on the second surface of said test board for receiving an integrated circuit device under test, said socket being provided with a plurality of pogo pins lengthwise through said socket;
• a plurality of ZIF connectors being arranged on the first surface of said test board, each of said plurality of ZIF connectors having a plurality of second through-holes parallelly arranged through said ZIF connectors, and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting said test substrate;
• and
• a plurality of detachably adjustable fastening means being disposed through the first through-holes and the second through-holes for assembling and disassembling said ZIF connectors on the first surface of said test substrate.

A method of fabricating a test board with ZIF connectors and, comprising the steps of:

• providing a test substrate having a first surface, a second surface, a plurality of first through-holes, the plurality of first through-holes being perpendicular to the first surface and the second surface of said test substrate;
• providing a plurality of ZIF connectors being arranged on the first surface of said test board, each of said plurality of ZIF connectors having a plurality of second through-holes parallelly arranged through said ZIF connectors, and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting said test substrate;
• and
• providing a plurality of detachably adjustable fastening means being disposed through the first through-holes and the second through-holes for assembling and disassembling said ZIF connectors on the first surface of said test substrate.

A method of fabricating a test board with ZIF connectors and, comprising the steps of:

• providing a test substrate having a first surface, a second surface, a plurality of first through-holes, the plurality of first through-holes being perpendicular to the first surface and the second surface of said test substrate;
• providing at least a socket being affixed on the second surface of said test board for receiving an integrated circuit device under test, said socket being provided with a plurality of pogo pins lengthwise through said socket;
• providing a plurality of ZIF connectors being arranged on the first surface of said test board, each of said plurality of ZIF connectors having a plurality of second through-holes parallelly arranged through said ZIF connectors, and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting said test substrate;
• and
• providing a plurality of detachably adjustable fastening means being disposed through the first through-holes and the second through-holes for assembling and disassembling said ZIF connectors on the first surface of said test substrate.

An IC device test system, comprising:

• a test board comprising:
• a test substrate having a first surface, a second surface, a plurality of first through-holes, the plurality of first through-holes being perpendicular to the first surface and the second surface of said test substrate;
• at least a socket being affixed on the second surface of said test board for receiving an integrated circuit device under test, said socket being provided with a plurality of pogo pins lengthwise through said socket;
• a plurality of ZIF connectors being arranged on the first surface of said test board, each of said plurality of ZIF connectors having a plurality of second through-holes parallelly arranged through said ZIF connectors, and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting said test substrate;
• and
• a plurality of detachably adjustable fastening means being disposed through the first through-holes and the second through-holes for assembling and disassembling said ZIF connectors on the first surface of said test substrate;
• a handler for receiving IC devices under test and placing the IC devices under test on said test board, and classifying in accordance with testing result of said IC devices after test;
• a tester with female plugs for connecting the plurality of corresponding ZIF connectors;
• and
• a controller for sending, receiving and processing a test signal of said tester.

An IC device test method, comprising the steps of:

• providing an integrated circuit device under test;
• providing a test board, which comprises:
• a test substrate having a first surface, a second surface, a plurality of first through-holes, the plurality of first through-holes being perpendicular to the first surface and the second surface of said test substrate;
• at least a socket being affixed on the second surface of said test board for receiving the integrated circuit device under test, said socket being provided with a plurality of pogo pins lengthwise through said socket;
• a plurality of ZIF connectors being arranged on the first surface of said test board, each of said plurality of ZIF connectors having a plurality of second through-holes parallelly arranged through said ZIF connectors, and pairs of electric terminals being deposed on the bottom of each ZIF connector for contacting said test substrate;
• and
• a plurality of detachably adjustable fastening means being disposed through the first through-holes and the second through-holes for assembling and disassembling said ZIF connectors on the first surface of said test substrate;
• providing a handler for loading the IC devices under test onto said test board for testing so as to generate an IC sorting based on test results of the IC devices;
• providing a tester with female plugs for connecting the plurality of corresponding ZIF connectors;
• and
• providing a controller for sending, receiving and processing test signals from said tester.