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AssigneeKorea Electronics Technology Institute
InventorsSe Hoon Park, Jun Chul Kim, Jong Chul Park, Nam Kee Kang, Woo Sung Lee, Chan Sei Yoo
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The chip embedded printed circuit board and a fabricating method thereof are disclosed, wherein a circuit pattern is formed by depositing a metal layer on a support layer, a semiconductor chip is packaged on a support layer to wrap the semiconductor chip and the circuit pattern on the support layer and to form an isolation layer, a via hole filled with conductive material is formed through the isolation layer for interlayer electrical connection, part of the support layer is selectively removed to form a plated heat sink, such that a packaging process can be performed in a very planar state and the plated heat sink can be integrated with a printed circuit board.
A fabricating method for chip embedded printed circuit board comprising:
A fabricating method for chip embedded printed circuit board comprising:
A chip embedded printed circuit board (PCB) wherein a circuit pattern is formed on a plated heat sink, a semiconductor chip is packaged on the circuit pattern, an isolation layer is formed on the plated heat sink wrapping the circuit pattern and the semiconductor chip, a metal layer is formed on the isolation layer, a via hole is formed on the circuit pattern through the isolation layer and the metal layer, and a plating layer is formed at an inner wall of the via hole.
A chip embedded printed circuit board wherein a first circuit pattern is formed on a plated heat sink, a first isolation layer is formed on the plated heat sink wrapping the first isolation layer, a second circuit pattern is formed on the first isolation layer, a via hole is formed on the first circuit pattern through the first isolation layer and the second circuit pattern, a first plating layer if formed at an inner wall of the first via hole, a semiconductor chip is packaged on the first isolation layer, a second isolation layer is formed on the first isolation layer wrapping the second circuit pattern and the semiconductor chip;
Dependencies are inferred from the claim text.