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US 2008/0290506 A1Published application
Semiconductor module and inverter device
AssigneeAisin Aw Co., Ltd.
InventorsKazuo Aoki, Junji Tsuruoka, Seiji Yasui
Life of this patent
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Abstract
A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.
Claims20
A semiconductor module comprising:
- a base plate;
- a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area;
- and
- a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate, wherein:
- the coolant flow paths are formed such that coolant flows in a coolant flow direction,
- the switching element and the diode element are arranged in line in a perpendicular direction with respect to the coolant flow direction in each of the substrates,
- the plurality of substrates includes a plurality of sets of substrates, each set of substrates being formed of a pair of substrates, with the plurality of sets of substrates being arranged in line in the perpendicular direction, and the pair of substrates forming each of the sets of substrates being arranged in series in the coolant flow direction, and
- for each of the sets of substrates, the switching element of one substrate of the pair of substrates is arranged on one side in the perpendicular direction, and the diode element of the other substrate of the pair of substrates is arranged on the one side in the perpendicular direction.
5 more elements
A semiconductor module comprising:
- a base plate;
- a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area;
- and
- a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate, wherein:
- the coolant flow paths are formed such that coolant flows in a coolant flow direction,
- the switching element and the diode element are arranged in line in a perpendicular direction with respect to the coolant flow direction in each of the substrates,
- a pair of substrates of the plurality of substrates is disposed in series in the coolant flow direction,
- the switching element is arranged on a first side in the perpendicular direction for one substrate of the pair of substrates and on a second side in the perpendicular direction for the other substrate of the pair of substrates, and
- the diode element is arranged on the second side in the perpendicular direction for the one substrate of the pair of substrates and on the first side in the perpendicular direction for the other substrate of the pair of substrates.
6 more elements
Dependencies are inferred from the claim text.