Method for making semiconductor chips having coated portions
AssigneeAvago Technologies Fiber IP (Singapore) Pte. Ltd.
InventorLaurence Ray MCCOLLOCH
Life of this patent
Estimating the term…
Abstract
A method for making semiconductor chips having coated portions can include mounting the chips in lead frames, stacking the lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating, and depositing a coating on the stacked lead frames using, for example, an evaporative coating machine. In this manner, the coating is deposited on exposed portions of chips, such as its edges, and is not deposited on masked portions of chips, such as bond pads.
Claims17
A method for making semiconductor chips having coated portions, comprising:
- mounting each of a plurality of chips in a plurality of lead frames;
- stacking the plurality of lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating;
- and
- depositing a coating on the stacked plurality of lead frames, whereby the coating is deposited on exposed portions of chips and is not deposited on masked portions of chips.
A method for making semiconductor chips having coated portions, comprising:
- mounting each of a plurality of chips in a plurality of lead frames, wherein a plurality of the lead frames are interconnected to each other to define a lead frame array;
- stacking one lead frame array having chips mounted thereon on another lead frame array having chips mounted thereon to define a lead frame array stack, wherein each lead frame is oriented in the lead frame array stack in an orientation in which a portion of each lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating;
- arraying the plurality of lead frame array stacks in a coating machine in an orientation in which each chip has a surface to be coated oriented at an oblique angle to a coating application direction;
- and
- directing a coating material in the coating application direction toward the arrayed lead frame array stacks, whereby the coating is deposited on the surfaces to be coated and is not deposited on masked portions of chips.
A stackable lead frame assembly, comprising:
- a lead frame having a mounting portion for mounting a semiconductor chip thereon and a registration portion having at least one feature engageable with a portion of another lead frame to align stacked lead frames with respect to each other and to spatially offset the lead frame from the another lead frame, a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating.
Dependencies are inferred from the claim text.