Method of Bonding Probes and Method of Manufacturing a Probe Card Using the Same

A method of manufacturing a probe card, comprising:

• preparing a multi-layered substrate;
• bonding probes to the multi-layered substrate;
• and
• assembling the multi-layered substrate with a printed circuit board for allowing the probes to be electrically connected to the printed circuit board, wherein bonding the probes to the multi-layered substrate comprises:
• forming bump layer patterns on terminals of the multi-layered substrate;
• forming a first wetting layer pattern and a non-wetting layer pattern on the bump layer patterns, the first wetting layer pattern having a wettability with respect to a solder paste, and the non-wetting layer pattern having a non-wettability with respect to the solder paste;
• forming the solder paste on the first wetting layer pattern and the non-wetting layer pattern;
• bonding the probes, which make contact with an object, to the solder paste;
• and
• reflowing the solder paste on the non-wetting layer pattern toward a surface of the first wetting layer pattern to form an adhesive layer on the first wetting layer pattern.