Multi-strand substrate for ball-grid array assemblies and method

A method for assembling ball-grid array (BGA) packages, comprising the steps of:

• providing a plurality of BGA substrates arranged in an N by M array within a printed circuit board having a thickness, wherein N and M are greater than or equal to 2, each of the plurality of BGA substrates having a plurality of bond posts on one side and a plurality of contact pads on an opposite side, wherein the thickness of the printed circuit board is selected such that the printed circuit board can be subjected to automated assembly processes without using a metal support pallet;
• attaching a semiconductor die to each of the plurality of BGA substrates, the semiconductor die having at least one bond pad;
• encapsulating the semiconductor die with an encapsulant;
• curing the encapsulant;
• attaching conductive solder balls to each of the plurality of contact pads;
• and
• dividing the N by M array into separate BGA packages.

A ball-grid array (BGA) package, comprising:

• a BGA substrate formed from BGA substrates arranged in a N by M array within a printed circuit board having a thickness, wherein N and M are greater than or equal to 2, the BGA substrate having a plurality of bond posts and a plurality of contact pads, wherein a size of the N by M array is selected such that the BGA substrate maintains a planarity variation less than approximately 0.15 mm after assembly;
• at least one semiconductor die coupled to the BGA substrate using the plurality of bond posts;
• and
• an encapsulant formed over the at least one semiconductor die.

A ball-grid array (BGA) package, comprising:

• a BGA substrate divided from BGA substrates arranged in a N by M array within a printed circuit board having a thickness, wherein N and M are greater than or equal to 2, the BGA substrate having a plurality of bond posts and a plurality of contact pads, wherein the thickness of the printed circuit board is selected such that the BGA substrate maintains a planarity variation less than approximately 0.15 mm after assembly;
• at least one semiconductor die coupled to the BGA substrate using the plurality of bond posts;
• and
• an encapsulant formed over the at least one semiconductor die.

A ball-grid array (BGA) package, comprising:

• a BGA substrate divided from BGA substrates arranged in a N by M array within a printed circuit board having a thickness, wherein N and M are greater than or equal to 2, the BGA substrate having a plurality of bond posts and a plurality of contact pads, wherein a size of the N by M array and the thickness of the printed circuit board is selected such that the BGA substrate maintains a planarity variation less than approximately 0.15 mm after assembly;
• at least one semiconductor die coupled to the BGA substrate using the plurality of bond posts;
• and
• an encapsulant formed over the at least one semiconductor die.