Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus
AssigneeKabushiki Kaisha Toshiba
InventorMinoru Takizawa
Life of this patent
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AssigneeKabushiki Kaisha Toshiba
InventorMinoru Takizawa
Estimating the term…
According to one embodiment, a printed circuit board includes a wiring board, a through-hole mount device, and a surface mount device. The wiring board has a first surface, a second surface opposite to the first surface, and through holes. The through-hole mount device has leads. The leads are soldered inside the through holes so that the through-hole mount device is mounted on the first surface. The leads have distal ends positioned inside the through holes. An adhesive fills the region between the wiring board and the through-hole mount device. The adhesive fixes the through-hole mount device to the first surface. A surface mount device is soldered to the second surface and closes the through holes in which the leads are inserted.
A printed circuit board comprising:
A printed circuit board comprising:
An electronic apparatus comprising:
Dependencies are inferred from the claim text.