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US 2008/0286958 A1Published application
Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same
OwnerChien-Wei Chang, Cheng-Kuo Mainventors
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OwnerChien-Wei Chang, Cheng-Kuo Mainventors
Estimating the term…
A semiconductor substrate for having enhanced adhesion to semiconductor device and its manufacturing method are provided. The wire circuit layout on the surface of the semiconductor substrate is of a specialized design and surface treatment for enhanced adhesion between the packaged adhered material and the substrate surface (the bonding pad in particular). In the manufacturing method of the semiconductor substrate, the processing by the passivation treatment or the roughening treatment of the whole or a part of the bonding pad on the substrate, such as the brown-oxide treatment or the black-oxide treatment, etc, and the use of an enlarged contact area act to enhance adhesion to the semiconductor device during the packaging of the semiconductor device.
A manufacturing method of a semiconductor substrate having enhanced adhesion to a semiconductor device having an electrical node, and the substrate having an internal wire configuration, a wire bonding pad electrically connecting with the internal wire configuration, a wire electrically connecting with the wire bonding pad and the semiconductor device, and a bonding pad adhering to the semiconductor device using an adhesive, wherein the bonding pad is first processed by a roughening treatment or a passivation treatment to form a roughened layer or a passivation layer on the bonding pad.
Dependencies are inferred from the claim text.