Method to Manufacture a Silicon Wafer Electronic Component Protected Against the Attacks and Such a Component
AssigneeGemalto SA
InventorMichel Thill
Life of this patent
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Abstract
In general, the invention relates to manufacturing a wafer. The method includes manufacturing a wafer that includes a front side and a back side, thinning the wafer down to a thickness suitable for an intended operation of the wafer, polarizing the substrate wafer from the back side, and cutting the wafer. The wafer is polarized such that an attempt to thin the wafer from the backside results in at least one selected from a group consisting of destruction of the wafer and damage to the wafer.
Claims17
(canceled)
(canceled)
The method of claim 4, wherein only the back side of the wafer is polarized.
A method to manufacture a wafer, comprising:
- manufacturing a wafer comprising a front side and a back side;
- thinning the wafer down to a thickness suitable for an intended operation of the wafer;
- and
- polarizing the wafer from the back side such that an attempt to thin the wafer from the backside results in at least one selected from a group consisting of destruction of the wafer and damage to the wafer;
- and
- cutting the wafer.
A silicon wafer electronic component comprising front side, a back side, a plurality of transistors, and a means for causing at least one selected from a group consisting of destroying the component and damaging the component in the event of there is an attempt to thin the component from the back side.
Dependencies are inferred from the claim text.