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US 2008/0280159 A1Published application
Copper Foil and Method of Manufacturing the Same
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsKenichiro Iwakiri, Seiji Nagatani
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AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsKenichiro Iwakiri, Seiji Nagatani
Estimating the term…
The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S) (1) where Rz(S) is a numerical value represented by μm.
A copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm,
A method of manufacturing copper foil, which is characterized in that using untreated copper foil which has roughness Rz of a matte surface of 1.0 μm to 5.0 μm as measured by a stylus-type roughness meter, a first-stage nodular treatment for nodular treatment which involves forming copper micro-particles on the matte surface of the untreated copper foil is performed in a first-stage nodular treatment solution having Cu (II) ion concentrations of in the range from 5 g/1 to 20 g/l, free SO42−ion concentrations of in the range from 30 g/1 to 100 g/l, 9-phenylacridine concentrations of in the range from 100 mg/1 to 200 mg/l and Cl ion concentrations of in the range from 20 mg/1 to 100 mg/l, in that a first-stage, preceding-step nodular treatment during the first-stage nodular treatment is performed by performing electrolysis at current densities of in the range from 15 A/dm2 to 30 A/dm2 for 2 seconds to 10 seconds in the first-stage nodular treatment solution at solution temperatures of in the range from 20° C. to 40° C., and further in that a first-stage, succeeding-step nodular treatment during the first-stage nodular treatment is performed by performing electrolysis at current density of in the range from 3 A/dm2 to 10 A/dm2 for 2 seconds to 10 seconds.
Dependencies are inferred from the claim text.