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US 2008/0280146 A1Published application
Pre-cut wafer structure with heat stress effect suppressed
AssigneeAtomic Energy Council-Institute of Nuclear Energy Research
InventorsWu Chih-Hung, Chang Kai-Sheng, Chu Kuan-Yu
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Abstract
A wafer is cut before a heat treatment. By the cutting, cutting lines are not bended after the heat treatment. A cutting accuracy is therefore improved and a good light-shining efficiency is obtained.
Claims8
A pre-cut wafer structure with heat stress effect suppressed, comprising:
- an epitaxy layer, said epitaxy layer having a plurality of vertical epitaxy saw marks and a plurality of horizontal epitaxy saw marks;
- and
- a substrate, said substrate being connected with said epitaxy layer, said substrate being processed through a cutting process with said vertical epitaxy saw marks and said horizontal epitaxy saw marks before a heat treatment effectuating a chemical change in the substrate, said cutting process having a processing depth down to one tenth of a thickness of said substrate with an error allowance smaller than 20 percent to form the pre-cut wafer structure with heat stress effect suppressed.
Dependencies are inferred from the claim text.