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US 2008/0279409 A1Published application
Headset with exchangeable speaker
AssigneeSony Ericsson Mobile Communications AB
InventorErnst Hupkes
Life of this patent
Estimating the term…
Abstract
An earpiece speaker system including an earpiece body through which an audio signal is provided, the earpiece body having a speaker mount surface, and a plurality of speaker modules mountable to the body. Each of the speaker modules includes a mount surface for mating with the earpiece body speaker mount surface for securing the speaker module thereto in order to reproduce the audio signal.
Claims15
An earpiece speaker system comprising:
- an earpiece body through which an audio signal is provided, the earpiece body having a speaker mount surface;
- and
- a plurality of speaker modules interchangeably mountable to the body;
- wherein each of the speaker modules includes a mount surface for mating with the earpiece body speaker mount surface for securing the speaker module thereto in order to reproduce the audio signal.
1 more element
An earpiece body through which an audio signal is provided, the earpiece body comprising;
- a mount surface for receiving a speaker module;
- a first pair of electrical contacts for providing a suitable electrical signal to a first speaker module type;
- and
- a second set of electrical contacts for providing a suitable electrical signal to a second speaker module type.
1 more element
An earpiece speaker comprising:
- an earpiece body through which an audio signal is provided;
- a speaker for reproducing the audio signal;
- and
- a plurality of ear inserts removably attachable to the at least one of the earpiece body and the speaker;
- wherein the plurality of ear inserts include at least one in-ear insert and at least one in-concha insert.
2 more elements
Dependencies are inferred from the claim text.