Polymerizable composition and (meth) acrylic thermally conductive sheet

Abstract

A polymerizable composition which contains a component (A): a (meth)acrylic monomer, a component (B): a (meth)acrylic polymer having at least one functional group capable of undergoing a cross-linking reaction in its molecule, a component (C): a (meth) acrylic oligomer having at one terminal of its molecule a functional group capable of undergoing a cross-linking reaction, a component (D): a cross-linking agent having a functional group capable of undergoing a cross-linking reaction, a compound (E): a photopolymerization initiator and/or a thermal polymerization initiator, and a component (F): a thermally conductive filler, is disclosed. Further, a (meth)acrylic thermally conductive sheet having a pressure-sensitive adhesive layer prepared by polymerizing and cross-linking the polymerizable composition on a support is disclosed. The thermally conductive sheet prepared by using the polymerizable composition according to the invention is excellent in flexibility, adhesiveness and bleed resistance and can dissipate heat generated from a heat-generating body such as an electronic device with good efficiency.

Dependencies are inferred from the claim text.