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US 2008/0259557 A1Published application
Device cooling system
AssigneeHewlett-Packard Development Company, L.P.
InventorsJeffrey A. Lev, Mark S. Tracy
Life of this patent
Estimating the term…
Abstract
A device cooling system comprises a heat pipe disposed in a device, the heat pipe having a condenser portion and at least two divergent evaporator portions, the at least two evaporator portions coupled to at least one heat-generating component of the device.
Claims26
A device cooling system, comprising:
- a heat pipe disposed in a device, the heat pipe having a condenser portion and at least two divergent evaporator portions, the at least two evaporator portions coupled to at least one heat-generating component of the device.
A method for manufacturing a device cooling system, comprising:
- providing a heat pipe having a condenser portion and at least two divergent evaporator portions;
- and
- coupling the at least two evaporator portions to at least one heat-generating component of a device
A device cooling system, comprising:
- a heat pipe disposed in a device, the heat pipe comprising first and second evaporator portions each coupled to a different heat-generating component of the device for transferring thermal energy therefrom, the first and second evaporator portions each coupled to a condenser portion of the heat pipe.
A device cooling system, comprising:
- a heat pipe disposed in a device, the heat pipe comprising a condenser portion and a plurality of branches in fluid communication with the condenser portion, the plurality of branches each terminating at an evaporator portion of the heat pipe.
Dependencies are inferred from the claim text.