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US 2008/0258598 A1Published application
Heat Exchange Enhancement
AssigneeHong Kong Applied Science and Technology Research Institute Company Limited
InventorGeoffrey Wen-Tai Shuy
Life of this patent
Estimating the term…
Abstract
A heat exchange device that includes a structural section and a thin layer of material attached to a surface of the structural section. The thin layer of material has a thickness less than 100 microns. The combination of the structural section and the thin layer of material has a higher thermal transfer coefficient than the structural section alone, the thermal transfer coefficient representing an ability to exchange thermal energy with an ambient gas.
Claims14
1-23. (canceled)
An apparatus comprising:
- an electronic device;
- and
- a heat exchange structure on which the electronic device is attached, the heat exchange structure comprising
- a structural section to define a structure of the heat exchange structure, and
- a thin layer of material coupled to at least a portion of a surface of the structural section, the thin layer of material having a thickness less than 100 microns;
- wherein the combination of the structural section and the thin layer of material has a higher thermal transfer coefficient than the structural section alone, the thermal transfer coefficient representing an ability to exchange thermal energy with an ambient gas.
3 more elements
An MR-16 lamp comprising:
- a heat exchange device comprising:
- a structural section;
- and
- a thin layer of ceramic material attached to a surface of the structural section, the thin layer of ceramic material having a thickness less than 100 microns;
- and
- light emitting diodes mounted on the heat exchange device and configured to dissipate heat through the heat exchange device.
3 more elements
A wall wash lamp comprising:
- a heat exchange device comprising:
- a structural section;
- and
- a thin layer of ceramic material attached to a surface of the structural section, the thin layer of ceramic material having a thickness less than 100 microns;
- and
- light emitting diodes mounted on the heat exchange device and configured to dissipate heat through the heat exchange device.
3 more elements
34-44. (canceled)
Dependencies are inferred from the claim text.