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US 2008/0258290 A1Published application
Semiconductor device and method for manufacturing the same
AssigneeNEC Electronics Corporation
InventorKeiichi Nakajima
Life of this patent
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Abstract
A COF which can effectively dissipate the heat by using a simple structure and its manufacturing method. A semiconductor device of COF, which is formed over the main surface of a flexible substrate having no device hole and where a semiconductor chip is mounted over the inner lead interconnection, is characterized by forming a first resin layer over the second main surface of the flexible substrate opposite the side where the semiconductor chip is mounted and at the position corresponding to the semiconductor chip.
Claims11
A semiconductor device comprising:
- a semiconductor chip mounted over a first surface of a flexible substrate which does not have a device hole,
- wherein a resin layer is formed over a second surface of said flexible substrate opposite the side where the semiconductor chip is mounted and at the position corresponding to said semiconductor chip.
A method for manufacturing a semiconductor device comprising:
- mounting a semiconductor chip over a first surface of a flexible substrate;
- forming a resin layer by a resin printing technique over a second surface of said flexible substrate and at the position of said semiconductor chip.
Dependencies are inferred from the claim text.