Back to results
US 2008/0258289 A1Published application
Integrated circuit package system for package stacking
AssigneeSTATS ChipPAC, Ltd.
InventorsRajendra D. Pendse, Flynn Carson, Il Kwon Shim, Seng Guan Chow
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system comprising: forming an area array substrate; mounting surface conductors on the area array substrate; forming a molded package body on the area array substrate and the surface conductors; providing a step in the molded package body; and exposing a surface conductor by the step.
Claims20
An integrated circuit package system comprising:
- forming an area array substrate;
- mounting surface conductors on the area array substrate;
- forming a molded package body on the area array substrate and the surface conductors;
- providing a step in the molded package body;
- and
- exposing a surface conductor by the step.
3 more elements
An integrated circuit package system comprising:
- forming an area array substrate having a component side and a system side;
- mounting surface conductors on the area array substrate including pressing a solder ball;
- forming a molded package body on the area array substrate and the surface conductors including a core section;
- providing a step in the molded package body including reducing a step height from the core section for forming a region surrounding the core section being coplanar to the area array substrate;
- and
- exposing a surface conductor by the step for reducing a package height of a package stack.
3 more elements
An integrated circuit package system comprising:
- an area array substrate;
- surface conductors mounted on the area array substrate;
- and
- a molded package body, having a step, on the area array substrate and the surface conductors includes the surface conductors exposed by the step.
1 more element
Dependencies are inferred from the claim text.