Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the same

An electronic apparatus comprising:

• a substrate;
• a plurality of lower chips stacked on the substrate and having an active surface oriented in a direction toward the substrate;
• and
• at least one upper chip that is electrically connected to the substrate via a bump disposed between the lower chips.

A method of manufacturing a semiconductor device stack package, the method comprising:

• providing a substrate;
• providing a plurality of lower chips on the substrate such that an active surface of the lower chips is oriented in a direction toward the substrate and such that the lower chips and the substrate are electrically connected via a bump;
• providing an upper chip on the lower chips such that an active surface of the upper chips is oriented toward the substrate;
• and
• providing the upper chip to be electrically connected to the substrate via a bump disposed between the lower chips.