Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal
AssigneeInfineon Technologies AG
InventorsBernd Betz, Jochen Dangelmaier, Stefan Paulus
Life of this patent
Estimating the term…
Abstract
A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.
Claims27
1-15. (canceled)
A process for producing a leadframe configured to be fitted with a semiconductor chip and to be encapsulated with a plastic compound, the process comprising:
- providing a leadframe;
- applying an interlayer attackable by an etchant that comprises one or more individual layers, to the leadframe;
- and
- etching into the surface of the interlayer using the etchant.
A process for producing a semiconductor device, comprising:
- producing a leadframe including, providing the leadframe, applying an interlayer attackable by an etchant that comprises one or more individual layers, to the leadframe, and etching into the surface of the interlayer using the etchant;
- placing a semiconductor chip onto the leadframe;
- and
- applying a plastic compound as encapsulating housing to the leadframe and semiconductor chip.
A leadframe configured to fit with a semiconductor chip and to be encapsulated with a plastic compound, the leadframe comprising:
- a metallic single-piece base body of a leadframe,
- at least one interlayer which has been applied to the base body and may comprise one or more individual layers, and
- the interlayer having a surface comprising a matrix of islands of remaining material of substantially uniform height with voids extending between these islands.
A semiconductor device comprising:
- a semiconductor chip and having an encapsulation of plastic compound;
- a leadframe which is configured to be fitted with the semiconductor chip and to be encapsulated with the plastic compound, the leadframe comprising a metallic single-piece base body of a leadframe, at least one interlayer which has been applied to the base body and may comprise one or more individual layers, and
- the interlayer having a surface comprising a matrix of islands of remaining material of substantially uniform height with voids extending between these islands.
A leadframe which is intended to be fitted with a semiconductor chip and to be encapsulated with a plastic compound, the leadframe having the following features:
- a metallic single-piece base body of a leadframe,
- means for providing at least one interlayer which has been applied to the base body and may comprise one or more individual layers, and
- the interlayer means having a surface comprising a matrix of islands of remaining material of substantially uniform height with voids extending between these islands.
Dependencies are inferred from the claim text.