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US 2008/0258279 A1Published application
Leadframe for leadless package, structure and manufacturing method using the same
AssigneeChipMOS Technologies Inc.
InventorsChun Ying Lin, Geng Shin Shen, Yu Tang Pan, Shih Wen Chou
Life of this patent
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Abstract
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.
Claims20
A lead frame for leadless package, comprising:
- a plurality of package units, each of the package units including:
- a die pad with a plurality of openings;
- a plurality of pins disposed in the plurality of openings;
- and
- an adhesive tape fixing the plurality of package units.
2 more elements
A package structure for leadless package, comprising:
- a lead frame, including:
- a die pad with a plurality of openings;
- and
- a plurality of pins disposed in the plurality of openings;
- a die mounted on the die pad;
- and
- a plurality of lead wires electrically connecting the die and the die pad.
4 more elements
A manufacturing method for leadless package, comprising the steps of:
- providing a metal sheet covered by an adhesive tape;
- patterning the metal sheet to form a plurality of package units, each of the package units having a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings;
- fixing a plurality of dies on the die pads;
- electrically connecting each of the dies and the pins surrounding the die;
- and
- covering each of the dies, each of the package units and the plurality of lead wires with a molding material.
3 more elements
Dependencies are inferred from the claim text.