Non-Leaded Semiconductor Package and a Method to Assemble the Same

A method to assemble a leadframe strip assembly comprising:

• providing a metal foil;
• attaching a carrier tape to the metal foil;
• and
• forming a plurality of leadframes in the metal foil, each leadframe comprising a die pad laterally surrounded by a plurality of contact leads.

A method to assemble a non-leaded semiconductor package comprising:

• providing a panel according to claim 10;
• removing the carrier tape;
• and
• singulating the non-leaded semiconductor packages.

A non-leaded semiconductor package comprising:

• a leadframe comprising a die attach pad approximately in its lateral centre, laterally surrounded by a plurality of contact leads each having a contact area;
• semiconductor die including an active surface with a plurality of die contact pads and a passive surface, attached to the die attach pad electrically connected to the leadframe by a plurality of bond wires connecting the die contact pads and the lead contact areas of the contact leads;
• the upper surface of the die, contact leads, bond wires and space between the die pad and contact leads being encapsulated with mold material;
• and
• the bottom surface of the non-leaded package comprising mold material and the bottom surface of the die attach pad and contact leads on an essentially common plane.

A non-leaded semiconductor package having a leadframe strip assembly comprising:

• a semiconductor die;
• a carrier tape including a metal foil attached thereon;
• and
• a plurality of leadframes formed in the metal foil, each leadframe comprising a die pad laterally surrounded by a plurality of contact leads in the metal foil.