Electronic Component Mounting System, Electronic Component Mounting Device, and Electronic Component Mounting Method

An electronic component placing device for placing an electronic component in a multi-substrate on which a plurality of unit substrates are formed on the same substrate, comprising:

• a print test unit which determines the quality of a print state of a solder printed on electrodes formed on the plurality of unit substrates and outputs a determination result as solder test data in every unit substrate;
• a component placing mechanism which picks up the electronic component from a component supply unit and places the electronic component on the plurality of unit substrates on which the solder is printed;
• and
• a place control means which controls the component placing mechanism based on the solder test data to perform a component placing operation only on the unit substrate in which the print state of the solder is determined to be good.

An electronic component mounting method for mounting an electronic component on a multi-substrate in which a plurality of unit substrates are formed on the same substrate, comprising:

• a print test step for determining the quality of a print state of a solder printed on electrodes formed on the plurality of unit substrates and outputting a determination result as solder test data in every unit substrate;
• and
• a component placing steps for picking up the electronic component from a component supply unit by a component placing mechanism and placing the electronic component on the plurality of unit substrates on which the solder is printed,
• wherein, in the component placing step, the component placing mechanism is controlled based on the solder test data such that a component placing operation is performed only on the unit substrate in which the print state of the solder is determined to be good.