Ultrasound Transducer Assembly Having Improved Thermal Management

Abstract

An improved thermal management of an ultrasound transducer assembly is provided. The ultrasound transducer assembly includes an ultrasound transducer operable to transmit ultrasound energy along a propagation path; and a self-contained cooling system thermally coupling the ultrasound transducer to at least one heat sink. The self-contained cooling system includes at least one heat transfer member. The self-contained cooling system defines a heat flow from the ultrasound transducer assembly to the heat sink via the at least one heat transfer member. The propagation path of the ultrasound energy is opposite in direction to the heat flow path. The heat transfer process is augmented by the addition of a thermoelectric cooler positioned in thermal communication with the ultrasound transducer assembly. The self-contained cooling system provides for minimum thermal resistance, while the thermoelectric cooler maintains the heat flow in a positive direction and maintains positive thermal gradients thus enhancing the heat flow to the heat sink.

Dependencies are inferred from the claim text.