Method, system, program product for bonding two circuitry-including substrates and related stage

A system for bonding two circuitry—including substrates, the system comprising:

• a first stage for holding a first circuitry-including substrate and a second stage for holding a second circuitry-including substrate;
• means for identifying an alignment mark on each substrate;
• means for determining a location and topography of each alignment mark;
• means for creating an alignment model for each substrate based on the alignment mark locations and topographies;
• and
• means for bonding the first and second circuitry—including substrates together while aligning the first and second substrates based on the alignment model.

A program product stored on a computer-readable medium, which when executed, directs bonding of two circuitry-including substrates, the program product comprising:

• program code for identifying an alignment mark on each substrate;
• program code for determining a location and a topography of each alignment mark;
• program code for creating an alignment model for each substrate based on the location and topography the alignment mark thereon;
• and
• program code for directing bonding of the first and second circuitry—including substrates together while aligning the first and second substrates based on the alignment model.