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US 2008/0188020 A1Published application
Method of LED packaging on transparent flexible film
OwnerKuo Wei-Min, Yang Chien Chinginventors
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Abstract
A method of LED packaging on transparent on transparent flexible film by: depositing transparent ITO on a flexible transparent substrate to form a conducting layer, and then processing the conducting layer to form a circuit pattern, and then bonding LED chips to the circuit pattern, and then molding a lens over the LED chips to form 360° wide view angle LED package. The method has considered voltage and current matching and provides a suitable wire bond function zone for the LED chips, and keeps the gold wires well protected.
Claims6
A method of LED packaging on transparent on transparent flexible film, comprising the steps of:
- (a) depositing a transparent metal layer on a flexible transparent substrate by sputtering deposition to form a conducting layer;
- (b) processing the conducting layer into a predetermined circuit pattern;
- (c) forming a predetermined wire bond function zone and a power connection function zone on the patterned conducting layer and forming an insulative protective layer;
- (d) electroplating a layer of soft gold subject to a predetermined pattern for the wire bonding of a LED chip;
- (e) bonding LED chips to the wire bond function zone and then using gold wires to connect electrodes of the LED chips;
- and
- (f) using a mold to mold a lens on the conducting layer with epoxy resin.
4 more elements
Dependencies are inferred from the claim text.