Light-emitting device, method for manufacturing same, and molded part
AssigneeNichia Corporation
InventorsMasaki Hayashi, Hiroto Tamaki, Masafumi Kuramoto, Tomohide Miki, Takayuki Sano, Tomohisa Kishimoto
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Abstract
A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.
Claims11
A light-emitting device comprising a molded part comprising a thermosetting epoxy resin composition in the cured state,
- said epoxy resin composition comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride in an epoxy group equivalent to acid anhydride group equivalent ratio from 0.6 to 2.0, (B) an internal parting agent, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst,
- said internal parting agent (B) comprising a component having the general formula (1) and a melting point in the range of 50° C. to 90° C.,
- wherein R1, R2, and R3 are each independently H, —OH, —OR or —OCOCaHb, at least one of R1, R2, and R3 including —OCOCaHb, R is an alkyl group:
- CnH2n+1 wherein n is an integer of 1 to 10, “a” is an integer of 10 to 30, and “b” is an integer of 17 to 61.
A method for manufacturing a light-emitting device comprising a molded part comprising a thermosetting epoxy resin composition in the cured state, said epoxy resin composition comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride in an epoxy group equivalent to acid anhydride group equivalent ratio from 0.6 to 2.0, (B) an internal parting agent, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst, said internal parting agent (B) comprising a component having the general formula (1) and a melting point in the range of 50° C. to 90° C.,
- wherein R1, R2, and R3 are each independently H, —OH, —OR or —OCOCaHb, at least one of R1, R2, and R3 including —OCOCaHb, R is an alkyl group:
- CnH2n+1 wherein n is an integer of 1 to 10, “a” is an integer of 10 to 30, and “b” is an integer of 17 to 61, said method comprising the steps of:
- melt mixing a triazine derived epoxy resin with an acid anhydride to form (A) a reaction product,
- mixing (A) the reaction product with (B) an internal parting agent, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst to form a thermosetting epoxy resin composition,
- transfer molding the thermosetting epoxy resin composition in a mold with leads disposed therein, and
- placing a light-emitting element on the molded part of the thermoset epoxy resin composition for electrical connection to the leads.
A molded part for use in a light-emitting device, comprising a thermosetting epoxy resin composition in the cured state,
- said epoxy resin composition comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride in an epoxy group equivalent to acid anhydride group equivalent ratio from 0.6 to 2.0, (B) an internal parting agent, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst,
- said internal parting agent (B) comprising a component having the general formula (1) and a melting point in the range of 50° C. to 90° C.,
- wherein R1, R2, and R3 are each independently H, —OH, —OR or —OCOCaHb, at least one of R1, R2, and R3 including —OCOCaHb, R is an alkyl group:
- CnH2n+1 wherein n is an integer of 1 to 10, “a” is an integer of 10 to 30, and “b” is an integer of 17 to 61.
Dependencies are inferred from the claim text.