Method for designing a leadless chip carrier

A surface mount assembly comprising:

• (a) a leadless chip carrier with chamfered edges along one or more sides and with metallic connection portions disposed along one or more chamfered edges;
• and
• (b) a circuit board with a plurality of solder pads;
• wherein the leadless chip carrier and the circuit board have solder joints at an aligned connection of the solder pads to the metallic connection portions of the leadless chip carrier.

A method for surface mounting a leadless chip carrier to a circuit board, the method comprising the steps of:

• (a) providing the leadless chip carrier with chamfered edges along one or more sides and with package metallic connection portions disposed along one or more chamfered edges;
• (b) providing the circuit board with a plurality of circuit board metallic connection portions;
• (c) placing the leadless chip carrier on the circuit board with the package metallic connections and the circuit board metallic connections aligned for forming an interface;
• and
• (d) applying solder to the interface.