Plastic positioning pin for overmolded product
AssigneeSiemens VDO Automotive Corporation
InventorBrian G. Babin
Life of this patent
Estimating the term…
Abstract
An overmolded electronic device includes a pre-mold assembly having a positioning pin that extends upward through a mold material into contact with an inner cavity of a mold. The positioning pin is disposed within a containment area that is defined by sets of ribs configured in and conformed on the pre-mold assembly. The positioning pin thereby is sealed within the containment area that is in turn sealed from the remainder of the electronic device that prevents the intrusion of moisture or other contaminants into undesirable locations of the electronic device.
Claims22
A pre-mold assembly for an overmolded device comprising:
- a positioning pin that is engageable for aligning the pre-mold assembly within a mold cavity;
- and
- a first set of ribs and a second set of ribs disposed on the pre-mold assembly on opposing sides of the positioning pin.
An overmolded electrical device comprising:
- an electrical device;
- a pre-mold encasing a portion of the electric device, wherein the pre-mold comprises a positioning pin disposed between at least two sets of ribs that define a containment area within the overmolded electrical device;
- and
- an overmold encapsulating at least a portion of the pre-mold.
A method of over molding an electrical device comprising the steps of:
- a) forming a pre-mold over an electrical device;
- b) forming a positioning pin in the pre-mold for holding and aligning the pre-mold within a mold cavity;
- c) forming at least two sets of ribs on the pre-mold spaced apart from the positioning pin to define a containment area;
- and
- d) overmolding at least a portion of the pre-mold with a settable material.
Dependencies are inferred from the claim text.