Printed circuit board and semiconductor memory module using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJung-Chan CHO, Hyun-Seok CHOI, Yong-Hyun KIM, Hyung-Mo HWANG, Kyu-Tae KIM
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AssigneeSamsung Electronics Co., Ltd.
InventorsJung-Chan CHO, Hyun-Seok CHOI, Yong-Hyun KIM, Hyung-Mo HWANG, Kyu-Tae KIM
Estimating the term…
The invention provides a semiconductor memory module. The semiconductor memory module includes a printed circuit board part having a first surface and a second surface facing the first surface, and a metal core having an insert part inserted inside the printed circuit board part and an extension part elongated from at least one side of the printed circuit board. The semiconductor memory module also includes memory parts mounted on the printed circuit board. The metal core has a folding structure having at least one bent portion to substantially cover the memory parts.
A printed circuit board comprising:
A semiconductor memory module comprising:
Dependencies are inferred from the claim text.