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US 2008/0186681 A1Published application
Electronic assembly cooling
AssigneeBose Corporation
InventorsJoseph F. Deck, Bradley L. Hunter, Michael Nussbaum, Steven D. Owen
Life of this patent
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Abstract
An electronic assembly including a first heat producing device mounted on a first outer surface of a first portion of a circuit board. The first portion can deflect upwardly and downwardly relative to other portions of the circuit board. A first force element urges the first heat producing device against a heat sink. The force exerted by the first force element is variable with respect to time.
Claims22
An electronic assembly, comprising:
- a first heat producing device mounted on a first outer surface of a first portion of a circuit board, wherein the first portion can deflect upwardly and downwardly relative to other portions of the circuit board;
- and
- a first force element for urging the first heat producing device against a heat sink, wherein the force exerted by the first force element is variable with respect to time.
An audio amplifier comprising:
- a first power amplifier chip mounted on a first outer surface of a first portion of a circuit board;
- a second power amplifier chip mounted on the first outer surface of a second portion of the circuit board so that the first portion and the second portion can deflect upwardly and downwardly relative to each other;
- and
- a force source comprising a non-metallic material adjacent a second outer surface of a circuit board to urge the first power amplifier chip and the second amplifier chip against a heat sink with a force that is variable with respect to time.
1 more element
Dependencies are inferred from the claim text.