Back to results
US 2008/0186678 A1Published application
Nanoparticle Enhanced Heat Conduction Apparatus
AssigneeDell Products L.P.
InventorsTravis North, Michael Mincen Heatly
Life of this patent
Estimating the term…
Abstract
A heat conduction apparatus includes a sealed body having an inside surface and defining a cavity. A capillary structure is on the inside surface of the sealed body. A working fluid is in the cavity and includes nanoparticles. The heat conduction apparatus may be coupled to a heat producing component in order to provide greater heat dissipation capability than is provided by a heat conduction apparatus with a conventional working fluid.
Claims20
A heat conduction apparatus, comprising:
- a sealed body having an inside surface and defining a cavity;
- a capillary structure on the inside surface of the sealed body;
- and
- a working fluid in the cavity, wherein the working fluid comprises nanoparticles.
1 more element
An information handling system, comprising:
- a chassis;
- a processor mounted in the chassis;
- and
- a heat conduction apparatus thermally coupled to the processor, the heat conduction apparatus comprising:
- a sealed body having an inside surface and defining a cavity;
- a capillary structure on the inside surface of the sealed body;
- and
- a working fluid in the cavity, wherein the working fluid comprises nanoparticles.
5 more elements
A method of dissipating heat from a heat generating component comprising:
- providing a heat conduction apparatus thermally coupled to the heat generating component and comprising a sealed body defining a cavity and including an inside surface having a capillary structure, wherein a fluid including nanoparticles is in the cavity;
- thermally coupling the heat conduction apparatus to the heat generating component;
- and
- dissipating heat from the heat generating component with the fluid.
1 more element
Dependencies are inferred from the claim text.