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US 2008/0186677 A1Published application
System For Efficiently Cooling A Processor
AssigneeNVIDIA Corporation
InventorsZoran Stefanoski, Jeong H. Kim
Life of this patent
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Abstract
One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.
Claims14
A system for cooling a processor, the system comprising:
- a hybrid heat transport module configured to be thermally coupled to the processor and to a fansink adapted to use forces air to remove heat from the processor, the hybrid heat transport module including:
- a plurality of air channels adapted to receive the forced air from the fansink;
- and
- a fluid channel also adapted for removing heat from the processor.
1 more element
A method for cooling a processor, the method comprising the steps of:
- forcing air over a surface to continually remove heat from the processor;
- monitoring a temperature of the processor;
- and
- circulating a heat transfer fluid in a fluid channel of a hybrid heat transport module that is thermally coupled to the processor to further remove heat from the processor when the processor reaches a threshold temperature.
1 more element
Dependencies are inferred from the claim text.