US 2008/0186247 A1Published application

VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR mmWAVE APPLICATIONS

AssigneeInternational Business Machines Corporation

InventorsJohn Michael Cotte, Brian Paul Gaucher, Janusz Grzyb, Nils Deneke Hoivik, Christopher Vincent Jahnes, John Ulrich Knickerbocker, Duixian Liu, John Harold Magerlein, Chirag Suryakant Patel, Ullrich R. Pfeiffer

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Abstract

An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.

Claims20

Dependent claims

An apparatus comprising:

an interposer comprising a substrate having an upper and lower surface, said upper surface having at least one cavity for forming a portion of an antenna structure, said interposer including conducting through vias from said upper surface to said lower surface, said conducting through vias at said lower surface adapted for coupling to a source of electrical signals and a voltage supply,
a top Si part having interconnection wiring on a lower surface and having first pads for electrically mounting an integrated circuit chip thereon,
said top Si part having second pads on said lower surface mating with a plurality of conducting through vias at said upper surface of said interposer, and having an antenna positioned over said cavity for forming said antenna structure at times said top Si part is mated with said interposer.

Dependencies are inferred from the claim text.

Facts

Application: 12/062,665Filed 4 Apr 2008
Priority: 3 Aug 2006
Published: 7 Aug 2008
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10W 90/00
Package configurations
H01Q 1/2283
By structural association with other equipment or articles: mounted in or on the surface of a semiconductor substrate as a chip-type antenna or…
H10W 44/20
Electrical arrangements for controlling or matching impedance: at high-frequency [HF] or radio frequency [RF]
H10W 70/099
Package substrates; Interposers; Redistribution layers [RDL]: connecting interconnections to insulating or insulated package substrates,…

Family

Application11/498,689Continuation · filed 3 Aug 2006
Application12/062,665Continuation
US 2008/0029886 A1Published application
US 7,518,229 B2Related patent
US 7,808,798 B2Related patent
US 2008/0186247 A1This patent

From the US filing history. Foreign family members aren’t listed.

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